solder

Fewer workers are needed to solder circuit boards...

焊接电路板需要的工人更少了。

He then soldered the wire to the telephone terminal...

接着他把电话线焊接到电话机上。

We should the adhibit of solder paste before screen printing by automatic machine or by hand.

我们在进行锡膏印刷前应对锡膏进行一定的检测.如果没有专用设备也可以用以下的方法检查一下.

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PCBs are transported by a conveyor system over the preheat, solder and cooling stations.

电子线路板(PCB) 通过传送系统经过预热, 焊接和冷却区域.

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Used with the solder wire together, soldering a stainless steel etc metal.

同锡线一起使用, 焊接不锈钢等难以上锡的金属.

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Interface void damage is the failure characteristic of solder joint under temperature cycling.

温度循环载荷可以在焊点界面处形成足以导致空洞损伤发生的高应力三轴度.

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Solder side is chosen to measure.

4量测以吃锡面为选择点.

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Do the supplies use magnifying glass to full check PCB solder connections?

供应商是否用放大镜全面检查PCB的焊点?

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And techniques to make free solder bumping with electroplating are illustrated.

重点阐述了采用电镀制作无铅焊料凸点的方法.

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Do not use any warming device to heat up the solder paste.

切忌用加热工具对焊接材料进行加热.

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It's easy to learn to make a perfect solder joint when you use NIBCO Fittings.

如果使用美国尼伯科管件,很容易学会进行完美的焊料连接.

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Hand solder is recommended instead of reflow solder.

不建议使用回流焊,推荐使用手动焊接.

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Then reheat the solder cup of the fitting to draw up the alloy.

然后重新加热管件焊料杯口以吸入融合合金.

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The second section will introduce the new slide valve and its application in Solder Paste process.

第二部分介绍最新的滑动阀科技及其在点锡膏中的应用.

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Is the average and range of Solder Paste height measurements SPC controlled?

锡膏厚度测量的平均值和间距SPC是否受控?

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Above two years solder sale experience.

两年以上焊料销售经验.

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Titanium alloy solder bath : suitable for lead – free solder.

防腐蚀钛合金炉胆: 适用无铅工艺,寿命长. (先配项)

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No monitoring and control requirement on solder iron temperature.

对烙铁温度没有要求监测及控制.

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Oxide occurring after melting approximately 50 % less than common solder.

熔解后氧化物(锡渣)之发生量较一般焊锡减低近半.

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Are LCD's and UCLA's defined for the average and range of Solder Paste measurements?

对锡膏厚度测量的平均值和间距是否定义了其控制上限和下限?

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Careful tinning of the ends of wires results in a better joint when you solder them.

仔细对金属丝末端进行包锡有助于它们在焊接时很好地结合.

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The solder wire should attain the standard provision deflection and pitch by straightening.

焊丝经校直应达到标准规定的挺度和翘距.

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Theoretical models are given to qualitatively explain the relationship between the solder joint volume and performance.

理论模型也定量给出了焊膏厚度与焊点性能之间的关系.

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Is the time recorded when the solder paster is taken out from the storage case?

焊贴从存储环境取出时的时间是否有记录?

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If too much solder is used, it may flow past tube stop and clog sealing area.

如果使用的焊料太多, 那么有些焊料可能会流过管道阻挡部位,并堵塞密封区域.

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Block incoming electrical solder joints with different samples!

来料电机座的焊点与样品不同!

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So it will result in rigidity skin & block and solder balls etc.

产生的后果是:锡膏出现硬皮 、 硬块、难熔并产生大量锡球等.

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